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´ë±â¾Ð PLASM TREATMENT SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size Max. 200x200mm, 1set
Plasma Source RF Power Supply
GRAPHEEN FORMAL SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Quartz Tube ~¨ª150
Substrate Size ~4inch Wafer Set
Heating Chamber Furnace + Halogen Lamp Chamber
Substrate Temperature ~Max. 1000¡É
Heating Source Halogen Lamp + SiC Heater
¾ß¿Ü RTP SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module + Camera Module
Application/td> RTP System
Heating Source Halogen Lamp
Substrate Temperature ~Max. 300¡É