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´ë±â¾Ð PLASM TREATMENT SYSTEM
LAY-OUT | ITEM | DESCRIPTION |
---|---|---|
System Composition | Process Module | |
Substrate Size | Max. 200x200mm, 1set | |
Plasma Source | RF Power Supply |
GRAPHEEN FORMAL SYSTEM
LAY-OUT | ITEM | DESCRIPTION |
---|---|---|
System Composition | Quartz Tube ~¨ª150 | |
Substrate Size | ~4inch Wafer Set | |
Heating Chamber | Furnace + Halogen Lamp Chamber | |
Substrate Temperature | ~Max. 1000¡É | |
Heating Source | Halogen Lamp + SiC Heater |
¾ß¿Ü RTP SYSTEM
LAY-OUT | ITEM | DESCRIPTION |
---|---|---|
System Composition | Process Module + Camera Module | |
Application/td> | RTP System | |
Heating Source | Halogen Lamp | |
Substrate Temperature | ~Max. 300¡É |