엘에이티

융복합장치(In-Line / Cluster / Merge)

융복합 장치 Images
IN-LINE SPUTTERING SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch
Heating Source Halogen Lamp
Max. Heating Temperature ~1000℃
CLUSTER SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch Wafer 1 Set
Heating Source Halogen Lamp
Max. Heating Temperature ~Max. 1100℃
DUAL LOAD-LOCK SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module(SPT) + L/L Module + Process Module(RIE)
Substrate Size ~6inch Wafer
Gun Size 2~4inch
Power Generator RF Power ~1KW @ Auto Matching
DC Power ~1KW @ Noise Filter
PHSICAL VAPOR DEPOSITION SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch Wafer 1 Set
Heating Source Halogen Lamp
Max. Heating Temperature ~Max. 1100℃
A