엘에이티

식각장치

식각장치 Images
RIE SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size Max. 200x200mm, 1set
Plasma Source RF Power Supply
ICP-RIE SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size Max. 200x200mm, 1set
Plasma Source RF Power Supply