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열처리장치

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RAPID THERMAL PROCESS SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch
Heating Source Halogen Lamp
Max. Heating Temperature ~1000℃
RAPID THERMAL ANNEALING SYSTEM
LAY-OUT ITEM DESCRIPTION
System Composition Process Module
Substrate Size ~8inch Wafer 1 Set
Heating Source Halogen Lamp
Max. Heating Temperature ~Max. 1100℃
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