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RAPID THERMAL PROCESS SYSTEM
LAY-OUT |
ITEM |
DESCRIPTION |
|
System Composition |
Process Module |
Substrate Size |
~8inch |
Heating Source |
Halogen Lamp |
Max. Heating Temperature |
~1000¡É |
RAPID THERMAL ANNEALING SYSTEM
LAY-OUT |
ITEM |
DESCRIPTION |
|
System Composition |
Process Module |
Substrate Size |
~8inch Wafer 1 Set |
Heating Source |
Halogen Lamp |
Max. Heating Temperature |
~Max. 1100¡É |